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MC33PF8200DGES

MC33PF8200DGES

MC33PF8200DGES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8200DGES Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
MC33PF8200DGES Product Details

MC33PF8200DGES Overview


Tray is an acceptable method of shipping the power management.A convenient transport package is provided in 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA in order to prevent malfunction.The power management works at 2.5V~5.5V voltage.

MC33PF8200DGES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8200DGES Applications


There are a lot of NXP USA Inc. MC33PF8200DGESPower Management applications.

  • Base Station Power Distribution Systems
  • Automotive display
  • Equipment Run-Off of Battery Backup
  • Office Electronics
  • Chromebook
  • Electronic Test Equipment
  • Telecommunication
  • LP2996A: DDR3L
  • Switches
  • Industrial Equipment

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