MC33PF8200ESES Overview

Tray is acceptable as a shipping the power management method.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.As a result, this power management is powered by 2.7V~5.5V voltage.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received much praise.

MC33PF8200ESES Features

Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200ESES Applications

There are a lot of NXP USA Inc. MC33PF8200ESESPower Management applications.

• FPGA, DSP Core Power
• Portable Navigation Devices
• Electronic Test Equipment
• FPGA
• LP2996A: DDR3L
• Surround view system ECU
• Telecommunications Equipment
• Portable Systems
• Electronic Test Instrumentation
• Applications Processors