Shipments can be made in the direction of Tape & Reel (TR) .The package is conveniently packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.The power management operates at 2.5V~5.5V volts.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8200ESESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications Operating temperature: -40°C~105°C TA POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200ESESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200ESESR2Power Management applications.