CPU32+ Microprocessor M683xx Series MC68EN360 357-BBGA
SOT-23
MC68EN360CVR25L Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Package / Case
357-BBGA
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
M683xx
Published
1995
JESD-609 Code
e1
Part Status
Last Time Buy
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
357
ECCN Code
3A991.A.2
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
MC68EN360
JESD-30 Code
S-PBGA-B357
Speed
25MHz
uPs/uCs/Peripheral ICs Type
RISC MICROCONTROLLER
Core Processor
CPU32+
Voltage - I/O
5.0V
Ethernet
10Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
SCC, SMC, SPI
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
44
$112.31818
$4941.99992
MC68EN360CVR25L Product Details
MC68EN360CVR25L Overview
The microprocessor is convenient for international shipping since it is packaged in 357-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~85°C TA should be understood. This is part of the M683xx series. The CPU is powered by a CPU32+ core. There are DRAM RAM controllers on this CPU. This microprocessor features SCC, SMC, SPI interfaces to better serve its users. The CPU runs I/O at 5.0V. uPs/uCs/Peripheral ICs are a RISC MICROCONTROLLER. Using MC68EN360 will help you find variants of the cpu microprocessor. To date, there have been 357 terminations.
MC68EN360CVR25L Features
CPU32+ Core
MC68EN360CVR25L Applications
There are a lot of NXP USA Inc. MC68EN360CVR25L Microprocessor applications.