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MC68EN360RC33L

MC68EN360RC33L

MC68EN360RC33L

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68EN360 241-BEPGA

SOT-23

MC68EN360RC33L Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 241-BEPGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68EN360
Speed 33MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant
MC68EN360RC33L Product Details

MC68EN360RC33L Overview


With a packing size of 241-BEPGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~70°C TA. A M683xx series item. A CPU32+ processor is present in this CPU. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of SCC, SMC, SPI. 5.0V is the CPU's I/O address. You can search for variants of a microprocessor with MC68EN360.

MC68EN360RC33L Features


CPU32+ Core


MC68EN360RC33L Applications


There are a lot of NXP USA Inc.
MC68EN360RC33L Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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