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MC68EN360ZP33L

MC68EN360ZP33L

MC68EN360ZP33L

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68EN360 357-BGA

SOT-23

MC68EN360ZP33L Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 357-BGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68EN360
Speed 33MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $108.54000 $108.54
500 $107.4546 $53727.3
1000 $106.3692 $106369.2
1500 $105.2838 $157925.7
2000 $104.1984 $208396.8
2500 $103.113 $257782.5
MC68EN360ZP33L Product Details

MC68EN360ZP33L Overview


With a packing size of 357-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~70°C TA. A M683xx series item. A CPU32+ processor is present in this CPU. The CPU contains DRAM RAM controllers. This microprocessor is equipped with an interface of SCC, SMC, SPI. 5.0V is the CPU's I/O address. You can search for variants of a microprocessor with MC68EN360.

MC68EN360ZP33L Features


CPU32+ Core


MC68EN360ZP33L Applications


There are a lot of NXP USA Inc.
MC68EN360ZP33L Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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