CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA
SOT-23
MC68MH360CZQ25L Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
M683xx
Published
1997
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MC68MH360
Speed
25MHz
Core Processor
CPU32+
Voltage - I/O
5.0V
Ethernet
10Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
SCC, SMC, SPI
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
MC68MH360CZQ25L Product Details
MC68MH360CZQ25L Overview
The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around -40°C~85°C TA. The M683xx series contains it. A CPU32+ processor powers this CPU. DRAM RAM controllers are used by this CPU. This microprocessor has SCC, SMC, SPI interfaces to serve you better. I/O is run at 5.0V on this CPU. Try searching for variants of the cpu microprocessor with MC68MH360. Suppliers offer a 357-PBGA (25x25) package.
MC68MH360CZQ25L Features
CPU32+ Core
MC68MH360CZQ25L Applications
There are a lot of NXP USA Inc. MC68MH360CZQ25L Microprocessor applications.