CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA
SOT-23
MC68MH360VR33LR2 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~70°C TA
Packaging
Tape & Reel (TR)
Series
M683xx
Published
1995
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MC68MH360
Speed
33MHz
Core Processor
CPU32+
Voltage - I/O
5.0V
Ethernet
10Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
SCC, SMC, SPI
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
MC68MH360VR33LR2 Product Details
MC68MH360VR33LR2 Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the M683xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces SCC, SMC, SPI for better service. At 5.0V, the CPU runs its I/O. Search MC68MH360 for variants of the embedded microprocessor. It is offered by suppliers as a package 357-PBGA (25x25).
MC68MH360VR33LR2 Features
CPU32+ Core
MC68MH360VR33LR2 Applications
There are a lot of NXP USA Inc. MC68MH360VR33LR2 Microprocessor applications.