MC68MH360ZP25LR2 Overview

The embedded microprocessor has been packed in 357-BGA for convenient overseas shipping. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around 0°C~70°C TA is determined. This is a member of the M683xx series. With a core count of CPU32+, this CPU is multicore. A CPU with this architecture uses DRAM RAM controllers. With its SCC, SMC, SPI interfaces, this microprocessor will be able to serve you better. The CPU runs at 5.0V when it comes to I/O. Use MC68MH360 when searching for variants of the embedded microprocessor. Suppliers are offering 357-PBGA (25x25) packages.

MC68MH360ZP25LR2 Features

CPU32+ Core

MC68MH360ZP25LR2 Applications

There are a lot of NXP USA Inc.
MC68MH360ZP25LR2 Microprocessor applications.

• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances
• Home video and audio
• Entertainment products