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MC850DECVR50BUR2

MC850DECVR50BUR2

MC850DECVR50BUR2

NXP USA Inc.

Microprocessor MPC8xx Series MC850 256-BBGA

SOT-23

MC850DECVR50BUR2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 256-BBGA
Operating Temperature -40°C~95°C TA
Packaging Tape & Reel (TR)
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
USB USB 1.x (1)
Additional Interfaces HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART
RoHS Status Non-RoHS Compliant
MC850DECVR50BUR2 Product Details

MC850DECVR50BUR2 Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses SDRAM RAM controllers. This microprocessor features interfaces HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MC850 if you are looking for variants.

MC850DECVR50BUR2 Features




MC850DECVR50BUR2 Applications


There are a lot of NXP USA Inc.
MC850DECVR50BUR2 Microprocessor applications.


  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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