MCF5307AI66B

new-10%

Manufacturer part number:MCF5307AI66B

Manufacturer:NXP USA Inc.

Description:ROMless Coldfire V3 32-Bit Microcontroller MCF530x Series MCF5307 3.3V 208-BFQFP

Case Package:SOT-23

Datasheet:MCF5307AI66B Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Mounting Type	Surface Mount
Package / Case	208-BFQFP
Surface Mount	YES
Operating Temperature	0°C~70°C TA
Packaging	Tray
Series	MCF530x
Published	1999
JESD-609 Code	e3
Part Status	Not For New Designs
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	208
ECCN Code	3A991.A.2
Terminal Finish	Matte Tin (Sn)
HTS Code	8542.31.00.01
Terminal Position	QUAD
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	250
Supply Voltage	3.3V
Terminal Pitch	0.5mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	MCF5307
JESD-30 Code	S-PQFP-G208
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	3.6V
Supply Voltage-Min (Vsup)	3V
Oscillator Type	External
Number of I/O	16
Speed	66MHz
RAM Size	4K x 8
Voltage - Supply (Vcc/Vdd)	3V~3.6V
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	Coldfire V3
Peripherals	DMA, POR, WDT
Clock Frequency	33.33MHz
Program Memory Type	ROMless
Core Size	32-Bit
Connectivity	EBI/EMI, I2C, UART/USART
Bit Size	32
Address Bus Width	32
Boundary Scan	YES
Low Power Mode	YES
External Data Bus Width	32
Format	FIXED POINT
Integrated Cache	YES
Length	28mm
Height Seated (Max)	4.1mm
Width	28mm
RoHS Status	ROHS3 Compliant