The microprocessor is convenient for international shipping since it is packaged in 624-FBGA, FCBGA. The packaging method Tape & Reel (TR) provides high reliability. There are 2 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~125°C TJ should be understood. This is part of the i.MX6DP series. The CPU is powered by a ARM® Cortex®-A9 core. There are LPDDR2, DDR3L, DDR3 RAM controllers on this CPU. This microprocessor features CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces to better serve its users. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V. Suppliers offer 624-FCBGA (21x21) packages.
MCIMX6DP4AVT1ABR Features
ARM® Cortex®-A9 Core
MCIMX6DP4AVT1ABR Applications
There are a lot of NXP USA Inc. MCIMX6DP4AVT1ABR Microprocessor applications.