Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 624-FBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 2 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~105°C TA. In the i.MX6DP series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of LPDDR2, DDR3L, DDR3 RAM controllers are used by this CPU. The microprocessor features interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART for better service. At 1.8V 2.5V 2.8V 3.3V, the CPU runs its I/O. In total, 624 terminations have been made. The maximum supply current of this microprocessor is 1.5V. With a 16 width external data bus, this CPU has a wide external data bus. A CPU program transfers data by using 14 I/Os.
MCIMX6DP7CVT8AB Features
ARM® Cortex®-A9 Core 14 I/Os
MCIMX6DP7CVT8AB Applications
There are a lot of NXP USA Inc. MCIMX6DP7CVT8AB Microprocessor applications.