ARM® Cortex®-A9 Microprocessor i.MX6SLL Series 400-LFBGA
SOT-23
MCIMX6V2CVM08AB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
400-LFBGA
Operating Temperature
-40°C~105°C TJ
Packaging
Tray
Series
i.MX6SLL
Published
2002
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Speed
800MHz
Core Processor
ARM® Cortex®-A9
Voltage - I/O
1.2V 1.8V 2.5V 3.3V
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
Yes
RAM Controllers
LPDDR2, LPDDR3
USB
USB 2.0 OTG + PHY (2)
Co-Processors/DSP
Multimedia; NEON™ SIMD
Security Features
A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers
EPDC, LCD
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
152
$13.07730
$1987.7496
MCIMX6V2CVM08AB Product Details
MCIMX6V2CVM08AB Overview
The microprocessor is conveniently packaged in 400-LFBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around -40°C~105°C TJ. The i.MX6SLL series contains it. A ARM® Cortex®-A9 processor powers this CPU. LPDDR2, LPDDR3 RAM controllers are used by this CPU. I/O is run at 1.2V 1.8V 2.5V 3.3V on this CPU.
MCIMX6V2CVM08AB Features
ARM® Cortex®-A9 Core
MCIMX6V2CVM08AB Applications
There are a lot of NXP USA Inc. MCIMX6V2CVM08AB Microprocessor applications.