ARM® Cortex®-A7 Microprocessor i.MX6 Series 272-LFBGA
SOT-23
MCIMX6Y2DVK09AB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
272-LFBGA
Operating Temperature
0°C~95°C TJ
Packaging
Tray
Series
i.MX6
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Speed
900MHz
Core Processor
ARM® Cortex®-A7
Voltage - I/O
1.8V 2.8V 3.3V
Ethernet
10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
LPDDR2, DDR3, DDR3L
USB
USB 2.0 OTG + PHY (2)
Additional Interfaces
CAN, I2C, SPI, UART
Co-Processors/DSP
Multimedia; NEON™ MPE
Security Features
A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers
Electrophoretic, LCD
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
260
$9.83785
$2557.841
MCIMX6Y2DVK09AB Product Details
MCIMX6Y2DVK09AB Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 272-LFBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TJ. In the i.MX6 series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of LPDDR2, DDR3, DDR3L RAM controllers are used by this CPU. The microprocessor features interfaces CAN, I2C, SPI, UART for better service. At 1.8V 2.8V 3.3V, the CPU runs its I/O.
MCIMX6Y2DVK09AB Features
ARM® Cortex®-A7 Core
MCIMX6Y2DVK09AB Applications
There are a lot of NXP USA Inc. MCIMX6Y2DVK09AB Microprocessor applications.