ARM® Cortex®-A7 Microprocessor i.MX6 Series 289-LFBGA
SOT-23
MCIMX6Y7DVM09AB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Package / Case
289-LFBGA
Operating Temperature
0°C~95°C TJ
Packaging
Tray
Series
i.MX6
Published
2015
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Speed
900MHz
Core Processor
ARM® Cortex®-A7
Voltage - I/O
1.8V 2.8V 3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
LPDDR2, DDR3, DDR3L
USB
USB 2.0 OTG + PHY (2)
Additional Interfaces
CAN, I2C, SPI, UART
Co-Processors/DSP
Multimedia; NEON™ MPE
Security Features
A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers
Electrophoretic, LCD
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
152
$9.74737
$1481.60024
MCIMX6Y7DVM09AB Product Details
MCIMX6Y7DVM09AB Overview
The embedded microprocessor has been packed in 289-LFBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around 0°C~95°C TJ is determined. This is a member of the i.MX6 series. With a core count of ARM® Cortex®-A7, this CPU is multicore. A CPU with this architecture uses LPDDR2, DDR3, DDR3L RAM controllers. With its CAN, I2C, SPI, UART interfaces, this microprocessor will be able to serve you better. The CPU runs at 1.8V 2.8V 3.3V when it comes to I/O.
MCIMX6Y7DVM09AB Features
ARM® Cortex®-A7 Core
MCIMX6Y7DVM09AB Applications
There are a lot of NXP USA Inc. MCIMX6Y7DVM09AB Microprocessor applications.