512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K20 Series MK20DN512 3.3V 121-LFBGA
SOT-23
MK20DN512VMC10 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
121-LFBGA
Surface Mount
YES
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
Kinetis K20
Published
2002
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
121
ECCN Code
3A991.A.2
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
MK20DN512
JESD-30 Code
S-PBGA-B121
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
1.8/3.3V
Supply Voltage-Min (Vsup)
1.71V
Oscillator Type
Internal
Number of I/O
66
Speed
100MHz
RAM Size
128K x 8
Voltage - Supply (Vcc/Vdd)
1.71V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M4
Peripherals
DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency
32MHz
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
512KB 512K x 8
Connectivity
CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Supply Current-Max
77mA
Bit Size
32
Data Converter
A/D 38x16b; D/A 2x12b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
YES
ROM (words)
524288
CPU Family
CORTEX-M4
Length
8mm
Height Seated (Max)
1.52mm
Width
8mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$11.00000
$11
10
$10.11300
$101.13
25
$9.69400
$242.35
348
$8.12201
$2826.45948
696
$7.59800
$5288.208
MK20DN512VMC10 Product Details
MK20DN512VMC10 Description
With a diverse array of analog, communication, timing, and control peripherals to meet a variety of requirements, the Kinetis? K20 100 MHz MCU family offers a scalable portfolio with different levels of integration.
MK20DN512VMC10 Features
uses minimum-length links to increase performance and maximize board space.
enables existing applications to be smaller
offers performance efficiency while using less power.
by utilizing intelligent on-chip integration, significantly reduces BOM.
shares the portfolio's all-encompassing enablement and scalability