PowerPC G2_LE Microprocessor MPC82xx Series MPC8271 516-BBGA
SOT-23
MPC8271ZQPIEA Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
516-BBGA
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC82xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8271
Speed
300MHz
Core Processor
PowerPC G2_LE
Voltage - I/O
3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP
Communications; RISC CPM
RoHS Status
Non-RoHS Compliant
MPC8271ZQPIEA Product Details
MPC8271ZQPIEA Overview
With a packing size of 516-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around 0°C~105°C TA. A MPC82xx series item. A PowerPC G2_LE processor is present in this CPU. The CPU contains DRAM, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, SCC, SMC, SPI, UART, USART. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with MPC8271.
MPC8271ZQPIEA Features
PowerPC G2_LE Core
MPC8271ZQPIEA Applications
There are a lot of NXP USA Inc. MPC8271ZQPIEA Microprocessor applications.