Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC850 if you are looking for variants.
MPC850DEZQ66BU Features
MPC850DEZQ66BU Applications
There are a lot of NXP USA Inc. MPC850DEZQ66BU Microprocessor applications.