PowerPC e500 Microprocessor MPC85xx Series MPC8555 783-BBGA, FCBGA
SOT-23
MPC8555PXAQF Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
783-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8555
Speed
1.0GHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
USB
USB 2.0 (1)
Additional Interfaces
DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
MPC8555PXAQF Product Details
MPC8555PXAQF Overview
The microprocessor is convenient for international shipping since it is packaged in 783-BBGA, FCBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~105°C TA should be understood. This is part of the MPC85xx series. The CPU is powered by a PowerPC e500 core. There are DDR, SDRAM RAM controllers on this CPU. This microprocessor features DUART, I2C, PCI, SPI, TDM, UART interfaces to better serve its users. The CPU runs I/O at 2.5V 3.3V. Using MPC8555 will help you find variants of the cpu microprocessor. Suppliers offer 783-FCPBGA (29x29) packages.
MPC8555PXAQF Features
PowerPC e500 Core
MPC8555PXAQF Applications
There are a lot of NXP USA Inc. MPC8555PXAQF Microprocessor applications.