PowerPC e500 Microprocessor MPC85xx Series MPC8560 784-BBGA, FCBGA
SOT-23
MPC8560CPX667JB Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
784-BBGA, FCBGA
Supplier Device Package
783-FCPBGA (29x29)
Operating Temperature
-40°C~105°C TA
Packaging
Tray
Series
MPC85xx
Published
2002
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC8560
Speed
667MHz
Core Processor
PowerPC e500
Voltage - I/O
2.5V 3.3V
Ethernet
10/100/1000Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DDR, SDRAM
Additional Interfaces
I2C, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
MPC8560CPX667JB Product Details
MPC8560CPX667JB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 784-BBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~105°C TA. The cpu microprocessor belongs to the MPC85xx series. The CPU is cored with a PowerPC e500 processor. The CPU uses DDR, SDRAM RAM controllers. This microprocessor features interfaces I2C, PCI, RapidIO, SPI, TDM, UART. In this CPU, I/O is set to 2.5V 3.3V. The microprocessor can be searched for with MPC8560 if you are looking for variants. Suppliers offer a package of 783-FCPBGA (29x29).
MPC8560CPX667JB Features
PowerPC e500 Core
MPC8560CPX667JB Applications
There are a lot of NXP USA Inc. MPC8560CPX667JB Microprocessor applications.