MPC8xx Microprocessor MPC8xx Series MPC857 357-BBGA
SOT-23
MPC857DSLVR66B Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC8xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC857
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
RoHS Status
ROHS3 Compliant
MPC857DSLVR66B Product Details
MPC857DSLVR66B Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC8xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MPC857 for variants of the embedded microprocessor. It is offered by suppliers as a package 357-PBGA (25x25).
MPC857DSLVR66B Features
MPC8xx Core
MPC857DSLVR66B Applications
There are a lot of NXP USA Inc. MPC857DSLVR66B Microprocessor applications.