MPC8xx Microprocessor MPC8xx Series MPC857 357-BBGA
SOT-23
MPC857DSLZQ66B Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Supplier Device Package
357-PBGA (25x25)
Operating Temperature
0°C~105°C TA
Packaging
Tray
Series
MPC8xx
Published
2004
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
MPC857
Speed
66MHz
Core Processor
MPC8xx
Voltage - I/O
3.3V
Ethernet
10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
RoHS Status
Non-RoHS Compliant
MPC857DSLZQ66B Product Details
MPC857DSLZQ66B Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around 0°C~105°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU is cored with a MPC8xx processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC857 if you are looking for variants. Suppliers offer a package of 357-PBGA (25x25).
MPC857DSLZQ66B Features
MPC8xx Core
MPC857DSLZQ66B Applications
There are a lot of NXP USA Inc. MPC857DSLZQ66B Microprocessor applications.