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MPC860DECZQ66D4

MPC860DECZQ66D4

MPC860DECZQ66D4

NXP USA Inc.

Microprocessor MPC8xx Series MPC860 357-BBGA

SOT-23

MPC860DECZQ66D4 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case 357-BBGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Series MPC8xx
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC860
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
MPC860DECZQ66D4 Product Details

MPC860DECZQ66D4 Overview


The microprocessor is convenient for international shipping since it is packaged in 357-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~95°C TA should be understood. This is part of the MPC8xx series. There are DRAM RAM controllers on this CPU. This microprocessor features I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. The CPU runs I/O at 3.3V. Using MPC860 will help you find variants of the cpu microprocessor.

MPC860DECZQ66D4 Features




MPC860DECZQ66D4 Applications


There are a lot of NXP USA Inc.
MPC860DECZQ66D4 Microprocessor applications.


  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle

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