MPC860DTZQ66D4 Overview

Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. A MICROPROCESSOR, RISC represents the uPs/uCs/Peripheral ICs type. Search MPC860 for variants of the embedded microprocessor.

MPC860DTZQ66D4 Features

MPC860DTZQ66D4 Applications

There are a lot of NXP USA Inc.
MPC860DTZQ66D4 Microprocessor applications.

• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances
• Home video and audio