1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA
SOT-23
MPC860ENZQ50D4 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
357-BBGA
Surface Mount
YES
Operating Temperature
0°C~95°C TA
Packaging
Tray
Series
MPC8xx
Published
1995
JESD-609 Code
e0
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
357
ECCN Code
3A991.A.2
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
3.3V
Terminal Pitch
1.27mm
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
MPC860
JESD-30 Code
S-PBGA-B357
Supply Voltage-Max (Vsup)
3.465V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
3.135V
Speed
50MHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Clock Frequency
50MHz
Bit Size
32
Address Bus Width
32
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Voltage - I/O
3.3V
Ethernet
10Mbps (4)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
Length
25mm
Height Seated (Max)
2.52mm
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
44
$83.61205
$3678.9302
MPC860ENZQ50D4 Product Details
MPC860ENZQ50D4 Description
The MPC860ENZQ50D4 PowerQUICC? offers an integrated processor and peripheral solution that can be used in a variety of communications and networking controller applications. The MPC860ENZQ50D4 delivers higher performance in all areas of device operation including flexibility, extensions in capability, and integration provides lower power consumption than traditional architectures, and is backed by strong third-party tool support through Our Design Alliance Program.