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MSC8101M1375F

MSC8101M1375F

MSC8101M1375F

NXP USA Inc.

CPLD StarCore Series MSC8101 332-BFBGA, FCBGA

SOT-23

MSC8101M1375F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2004
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Base Part Number MSC8101
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate 275MHz
RoHS Status Non-RoHS Compliant
MSC8101M1375F Product Details

MSC8101M1375F Overview


This is an electronic component with a 332-BFBGA, FCBGA package.There is a packaging method of Tray provided with it.SC140 Core's wide range of applications makes it ideal for a wide variety of applications.The mounting is carried out in the direction of Surface Mount.It is essential that -40°C~105°C TJ is kept at a temperature that ensures proper operation of the machine.This refers to the analog voltage range that can be input or output from 3.30V.This digital signal processor is part of the StarCore series.The base part number MSC8101 can be used to identify many associated parts.

MSC8101M1375F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8101M1375F Applications


There are a lot of NXP USA Inc. MSC8101M1375F DSP applications.

  • Fourier transform
  • Seismology
  • Encoding/broadcast
  • Computer vision technology
  • MP3 audio player
  • Telephone conversations
  • Geoscience signal processing
  • Financial signals
  • Automobiles
  • Biomedical engineering

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