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MSC8101VT1375F

MSC8101VT1375F

MSC8101VT1375F

NXP USA Inc.

CPLD StarCore Series MSC8101 332-BFBGA, FCBGA

SOT-23

MSC8101VT1375F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2008
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Base Part Number MSC8101
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate 275MHz
RoHS Status ROHS3 Compliant
MSC8101VT1375F Product Details

MSC8101VT1375F Overview


It is a type of electronic component available in package 332-BFBGA, FCBGA.Packaging way Tray is provided.In addition to meeting a wide range of requirements, it is a member of SC140 Core.It is mounted in the direction of Surface Mount as shown in the image below.Operating at the temperature of -40°C~105°C TJ ensures its normal operation.Voltages can be input or output within 3.30V's analog voltage range.The StarCore series includes this digital signal processor.Based on its base part number of MSC8101, many ralated parts can be found.

MSC8101VT1375F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8101VT1375F Applications


There are a lot of NXP USA Inc. MSC8101VT1375F DSP applications.

  • Other sensor array processing
  • Control systems
  • Receivers
  • 3D tomography and imaging processing
  • Radar
  • Audio signal
  • Financial signals
  • Video coding, audio coding
  • Smart phones
  • Seismology

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