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MSC8103M1200F

MSC8103M1200F

MSC8103M1200F

NXP USA Inc.

CPLD StarCore Series MSC8103 332-BFBGA, FCBGA

SOT-23

MSC8103M1200F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature -40°C~75°C TJ
Packaging Tray
Published 2004
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Base Part Number MSC8103
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate 300MHz
RoHS Status Non-RoHS Compliant
MSC8103M1200F Product Details

MSC8103M1200F Overview


Basically, it is a type of electronic component that is available in a 332-BFBGA, FCBGA package.Tray packaging is provided for it.With its association with SC140 Core, it is suitable for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~75°C TJ in order to ensure its normal functioning.The analog voltage range of 3.30V refers to the input or output voltage.StarCore series digital signal processors contain this digital signal processor.Based on its base part number of MSC8103, many ralated parts can be found.

MSC8103M1200F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8103M1200F Applications


There are a lot of NXP USA Inc. MSC8103M1200F DSP applications.

  • Fourier transform
  • Tomography technology
  • Scene analysis technology
  • Automatic analysis system of EEG or ECG
  • Machinery and equipment
  • Seismology
  • Infrared
  • Smart camera
  • Electronic information engineering
  • Telephone conversations

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