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MSC8103VT1200F

MSC8103VT1200F

MSC8103VT1200F

NXP USA Inc.

CPLD StarCore Series MSC8103 332-BFBGA, FCBGA

SOT-23

MSC8103VT1200F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature -40°C~75°C TJ
Packaging Tray
Published 2008
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Reach Compliance Code unknown
Base Part Number MSC8103
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate 300MHz
RoHS Status ROHS3 Compliant
MSC8103VT1200F Product Details

MSC8103VT1200F Overview


In the 332-BFBGA, FCBGA package, it is a type of electronic component.Tray is the packaging method provided.In addition to meeting a wide range of requirements, it is a member of SC140 Core.It is mounted in the way of Surface Mount.As long as it is operated at the temperature of -40°C~75°C TJ, it will operate normally.The analog voltage range of 3.30V refers to the voltage that can be input or ouput.The StarCore series contains this digital signal processor.It is possible to identify numerous related parts using the base part number MSC8103.

MSC8103VT1200F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8103VT1200F Applications


There are a lot of NXP USA Inc. MSC8103VT1200F DSP applications.

  • Instrument modeling
  • Computer vision technology
  • Audio compression
  • Computers and laptop
  • Infinite impulse response filters
  • Seismology
  • Processing system
  • Infrared
  • Speech processing
  • Scene analysis technology

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