60KB 60K x 8 FLASH 8-Bit Microcontroller S08 Series S9S08AW60 64-QFP
SOT-23
S9S08AW60E5MFUE Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
64-QFP
Surface Mount
YES
Operating Temperature
-40°C~125°C TA
Packaging
Tray
Series
S08
Published
2005
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
ECCN Code
3A991.A.2
Terminal Finish
Matte Tin (Sn)
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
S9S08AW60
JESD-30 Code
S-PQFP-G64
Qualification Status
Not Qualified
Power Supplies
3/5V
Oscillator Type
Internal
Number of I/O
54
Speed
40MHz
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~5.5V
Peripherals
LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
8-Bit
Program Memory Size
60KB 60K x 8
Connectivity
I2C, SCI, SPI
Bit Size
8
Data Converter
A/D 16x10b
ROM (words)
63280
Screening Level
AEC-Q100
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
420
$6.12000
$2570.4
S9S08AW60E5MFUE Product Details
S9S08AW60E5MFUE Overview
The package is 64-QFP-shaped. There are 54 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 8-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the S08 series of electrical components. Having a size of 60KB 60K x 8, Microcontroller has a program memory of X bytes. IC Chip 64 has 64 terminations. 8-bits are used for its size. Using the base part number S9S08AW60, you will be able to find alternatives for the part.
S9S08AW60E5MFUE Features
64-QFP package Mounting type of Surface Mount
S9S08AW60E5MFUE Applications
There are a lot of NXP USA Inc. S9S08AW60E5MFUE Microcontroller applications.