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S9S08RN60W1MLF

S9S08RN60W1MLF

S9S08RN60W1MLF

NXP USA Inc.

60KB 60K x 8 FLASH 8-Bit Microcontroller S08 Series 48-LQFP

SOT-23

S9S08RN60W1MLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP
Operating Temperature -40°C~125°C TA
Packaging Tray
Series S08
Published 2012
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991.A.2
Terminal Finish MATTE TIN
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Oscillator Type Internal
Number of I/O 39
Speed 20MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~5.5V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Peripherals LVD, POR, PWM, WDT
Program Memory Type FLASH
Core Size 8-Bit
Program Memory Size 60KB 60K x 8
Connectivity I2C, LINbus, SPI, UART/USART
Data Converter A/D 16x12b
EEPROM Size 256 x 8
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,250 $2.46400 $2.464
S9S08RN60W1MLF Product Details

S9S08RN60W1MLF Overview


The package is 48-LQFP-shaped. There are 39 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 8-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the S08 series of electrical components. Having a size of 60KB 60K x 8, Microcontroller has a program memory of X bytes. This device belongs to the MICROPROCESSOR uPs/uCs/Peripheral ICs category.

S9S08RN60W1MLF Features


48-LQFP package
Mounting type of Surface Mount


S9S08RN60W1MLF Applications


There are a lot of NXP USA Inc.
S9S08RN60W1MLF Microcontroller applications.


  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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