3MB 3M x 8 FLASH e200z2, e200z4 32-Bit Dual-Core Microcontroller MPC57xx Series 100-LBGA
SOT-23
SP5746CBK1AMMH6R Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
100-LBGA
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Series
MPC57xx
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Speed
80MHz/160MHz
RAM Size
512K x 8
Voltage - Supply (Vcc/Vdd)
3V~5.5V
Core Processor
e200z2, e200z4
Peripherals
DMA, LVD, POR, WDT
Program Memory Type
FLASH
Core Size
32-Bit Dual-Core
Program Memory Size
3MB 3M x 8
Connectivity
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Data Converter
A/D 80x10b, 64x12b
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1,500
$19.68400
$19.684
SP5746CBK1AMMH6R Product Details
SP5746CBK1AMMH6R Overview
In a 100-LBGA package, the MCU is available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 32-Bit Dual-Core core is the core of the MCU. There is a FLASH type of memory for its program. There is a temperature range of -40°C~125°C TA that is operated by this Microcontroller. MPC57xx series components make up this electrical component. 3MB 3M x 8 is the size of its program memory. A e200z2, e200z4 Core processor is used to power the device.
SP5746CBK1AMMH6R Features
100-LBGA package Mounting type of Surface Mount
SP5746CBK1AMMH6R Applications
There are a lot of NXP USA Inc. SP5746CBK1AMMH6R Microcontroller applications.