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SPAKDSP303AG100

SPAKDSP303AG100

SPAKDSP303AG100

NXP USA Inc.

CPLD DSP563xx Series SPAKDSP303 144-LQFP

SOT-23

SPAKDSP303AG100 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 144-LQFP
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number SPAKDSP303
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
RoHS Status ROHS3 Compliant
SPAKDSP303AG100 Product Details

SPAKDSP303AG100 Overview


An electronic component available in package 144-LQFP.Tray is the packaging method provided.Due to its membership in Fixed Point, it is ideally suited for a wide range of uses.There is a mounting point for it along the direction of Surface Mount.Operating at the temperature of -40°C~105°C TJ ensures its normal operation.In analog circuits, the analog voltage range 3.30V represents the voltage range that is available for input or output.As part of the DSP563xx series, this digital signal processor is included.It is possible to identify numerous related parts using the base part number SPAKDSP303.

SPAKDSP303AG100 Features


Supplied in the 144-LQFP package

SPAKDSP303AG100 Applications


There are a lot of NXP USA Inc. SPAKDSP303AG100 DSP applications.

  • Tomography technology
  • Automatic analysis system of EEG or ECG
  • Real-time effects
  • Financial signals
  • Speech signal processing
  • Airplanes
  • Seismology
  • Smart camera
  • Speech processing and recognition
  • Video coding, audio coding

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