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SPAKDSP303VF100

SPAKDSP303VF100

SPAKDSP303VF100

NXP USA Inc.

CPLD DSP563xx Series SPAKDSP303 196-LBGA

SOT-23

SPAKDSP303VF100 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number SPAKDSP303
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
RoHS Status Non-RoHS Compliant
SPAKDSP303VF100 Product Details

SPAKDSP303VF100 Overview


The 196-LBGA package contains these electronic components.A packaging way of Tray is provided.Due to its Fixed Point membership, it is ideal for a wide range of applications.The machine is mounted in the way of Surface Mount in order to facilitate its operation.Operating at the temperature of -40°C~105°C TJ ensures its normal operation.This refers to the analog voltage range that can be input or output from 3.30V.This digital signal processor is part of the DSP563xx series.There are a number of related parts that can be identified using the base part number SPAKDSP303.

SPAKDSP303VF100 Features


Supplied in the 196-LBGA package

SPAKDSP303VF100 Applications


There are a lot of NXP USA Inc. SPAKDSP303VF100 DSP applications.

  • Sonar
  • Infinite impulse response filters
  • Streaming videos
  • Statistical signal processing
  • Real-time effects
  • Image signal processing
  • Automobiles
  • Digital communications
  • Processing system
  • Tomography technology

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