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SPAKDSP303VL100

SPAKDSP303VL100

SPAKDSP303VL100

NXP USA Inc.

CPLD DSP563xx Series SPAKDSP303 196-LBGA

SOT-23

SPAKDSP303VL100 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2005
Series DSP563xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number SPAKDSP303
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
RoHS Status ROHS3 Compliant
SPAKDSP303VL100 Product Details

SPAKDSP303VL100 Overview


It is a kind of electronic component that comes in a package of 196-LBGA.There is a packaging method of Tray provided with it.Fixed Point members are well suited for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~105°C TJ in order to ensure its normal functioning.This refers to the analog voltage range that can be input or output from 3.30V.This digital signal processor is part of the DSP563xx series.With its base part number SPAKDSP303, it is possible to identify a number of related parts.

SPAKDSP303VL100 Features


Supplied in the 196-LBGA package

SPAKDSP303VL100 Applications


There are a lot of NXP USA Inc. SPAKDSP303VL100 DSP applications.

  • Computer vision technology
  • Automatic analysis system of EEG or ECG
  • Digital image processing
  • Biomedical treatment
  • Smart phones
  • Voice recognition
  • Streaming music
  • Scene analysis technology
  • Statistical signal processing
  • Telephone conversations

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