1MB 1M x 8 FLASH e200z0, e200z1 32-Bit Dual-Core Microcontroller MPC55xx Qorivva Series SPC5516 208-BGA
SOT-23
SPC5516EAMMG66 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
208-BGA
Operating Temperature
-40°C~125°C TA
Packaging
Tray
Series
MPC55xx Qorivva
Published
2006
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
SPC5516
Oscillator Type
Internal
Number of I/O
144
Speed
66MHz
RAM Size
64K x 8
Voltage - Supply (Vcc/Vdd)
4.5V~5.25V
Core Processor
e200z0, e200z1
Peripherals
DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit Dual-Core
Program Memory Size
1MB 1M x 8
Connectivity
CANbus, EBI/EMI, I2C, SCI, SPI
Data Converter
A/D 40x12b
RoHS Status
ROHS3 Compliant
SPC5516EAMMG66 Product Details
SPC5516EAMMG66 Overview
Packaged in a 208-BGA format. A total of 144 I/Os are on the Microcontroller. Surface Mount is the mounting type of the Microcontroller that is attached to the panel. This Microcontroller is based on a core called 32-Bit Dual-Core. The type of its program memory is FLASH. In this Microcontroller, temperature is controlled within the range -40°C~125°C TA. A MPC55xx Qorivva series electrical component is used in this application. This program has a program memory of 1MB 1M x 8 bytes, which is the size of the program. With a e200z0, e200z1 Core Processor, Microcontroller is fast and efficient. Alternatives can be found by searching through the base part number SPC5516 to find them.
SPC5516EAMMG66 Features
208-BGA package Mounting type of Surface Mount
SPC5516EAMMG66 Applications
There are a lot of NXP USA Inc. SPC5516EAMMG66 Microcontroller applications.