1.5MB 1.5M x 8 FLASH e200z0, e200z1 32-Bit Dual-Core Microcontroller MPC55xx Qorivva Series SPC5517 208-BGA
SOT-23
SPC5517GAMMG66 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
208-BGA
Operating Temperature
-40°C~125°C TA
Packaging
Tray
Series
MPC55xx Qorivva
Published
2006
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
SPC5517
Oscillator Type
Internal
Number of I/O
144
Speed
66MHz
RAM Size
80K x 8
Voltage - Supply (Vcc/Vdd)
4.5V~5.25V
Core Processor
e200z0, e200z1
Peripherals
DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit Dual-Core
Program Memory Size
1.5MB 1.5M x 8
Connectivity
CANbus, EBI/EMI, I2C, SCI, SPI
Data Converter
A/D 40x12b
RoHS Status
ROHS3 Compliant
SPC5517GAMMG66 Product Details
SPC5517GAMMG66 Overview
Packaged in a 208-BGA format, this MCU is available in a compact size. There are 144 I/Os on the Microcontroller. It is important to note that the Microcontroller has a Surface Mount mounting type. 32-Bit Dual-Core core is the basis for this Microcontroller. This program has a type of memory called FLASH for this MCU's program memory. Temperatures in this range are operated by this Microcontroller. The MPC55xx Qorivva series includes this electrical component. There is 1.5MB 1.5M x 8 bytes of program memory in MCU, which corresponds to the size of the program. With a e200z0, e200z1 Core processor, MCU is equipped with the latest technology available. Alternatives can be found by looking at the base part number SPC5517.
SPC5517GAMMG66 Features
208-BGA package Mounting type of Surface Mount
SPC5517GAMMG66 Applications
There are a lot of NXP USA Inc. SPC5517GAMMG66 Microcontroller applications.