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SPC5748GHK0AMKU6

SPC5748GHK0AMKU6

SPC5748GHK0AMKU6

NXP USA Inc.

6MB 6M x 8 FLASH e200z2, e200z4, e200z4 32-Bit Tri-Core Microcontroller MPC57xx Series 1.2V 176-LQFP Exposed Pad

SOT-23

SPC5748GHK0AMKU6 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tray
Series MPC57xx
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176
ECCN Code 5A992
Terminal Finish Tin (Sn)
Additional Feature EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE, SUPPORT CAN FD, 2ND ETHERNET
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G176
Supply Voltage-Max (Vsup) 1.32V
Supply Voltage-Min (Vsup) 1.08V
Oscillator Type Internal
Number of I/O 129
Speed 80MHz/160MHz
RAM Size 768K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z2, e200z4, e200z4
Peripherals DMA, LVD, POR, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 32-Bit Tri-Core
Program Memory Size 6MB 6M x 8
Connectivity CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Bit Size 32
Data Converter A/D 80x10b, 64x12b
Has ADC YES
DMA Channels YES
PWM Channels NO
DAC Channels NO
ROM (words) 6291456
On Chip Program ROM Width 8
Screening Level ISO 26262
RAM (bytes) 786432
Height Seated (Max) 1.6mm
Length 24mm
Width 24mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
200 $37.85950 $7571.9
SPC5748GHK0AMKU6 Product Details

SPC5748GHK0AMKU6  Features

2 x 160 MHz Power Architecure⑧e20024 Dual issue,

32-bit CPU

- Single precision floating point operations

-8 KB instruction cache and 4 KB data cache

-Variable length encoding (VLE) for significant code

density improvements

1 x 80 MHz Power Architecture c20022 Single issue,

32-bit CPU

-Using variable length encoding (VLE) for

significant code size footprint reduction

End to end ECC

- All bus masters, for example, cores generate single

error correction, double error detection (SECDED)

code for every bus transaction

SECLUDED covers 64-bit data and 29-bit address

Memory interfaces

- 6 MB on-chip flash supported with the flash

controller

- 3 x flash page buffers (3 port flash controller)

- 768 KB on-chip SRAM across three RAM ports

* Clock interfaces

- 8-40 MHz exteral crystal (FXOSC)

- 16 MHz IRC (FIRC)

- 128 kHz IRC (SIRC)

- 32 kHz external crystal (SXOSC)

- Clock Monitor Unit (CMU)

-Frequency modulated phase-locked loop (FMPLL)

-Real Time Counter (RTC)

2x System Memory Protection Unit (SMPU) each with

16 region descriptors and 16-byte region granularity

* 16 Semaphores to manage access to a shared resource

Interrupt controller (INTC) capable of routing

interrupts any CPU

Multiple crossbar switch architecture for concurrent

access to peripherals, flash, and RAM from multiple

bus masters

32-channels DMA controller with multiple transfers

request sources using DMAMUX




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