8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 416-BGA
SOT-23
SPC5777CAK3MME3 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
416-BGA
Operating Temperature
-40°C~125°C TA
Packaging
Tray
Series
MPC57xx
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Speed
264MHz
RAM Size
512K x 8
Voltage - Supply (Vcc/Vdd)
3V~5.5V
Core Processor
e200z7
Peripherals
DMA, LVD, POR, Zipwire
Program Memory Type
FLASH
Core Size
32-Bit Tri-Core
Program Memory Size
8MB 8M x 8
Connectivity
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Data Converter
A/D 16b Sigma-Delta, eQADC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
200
$37.01850
$7403.7
SPC5777CAK3MME3 Product Details
SPC5777CAK3MME3 Overview
416-BGA-packages are available. Device mounting type Surface Mount is the type of mounting that the Microcontroller uses. There is a 32-Bit Tri-Core core at the core of this MCU. There is a type of program memory called FLASH in the Microcontroller. There is a temperature range of -40°C~125°C TA for this Microcontroller. An electrical component of this type belongs to the MPC57xx series. This program memory has a size of 8MB 8M x 8, which indicates what the size of the program memory is. e200z7 Core processors are used in MCU.
SPC5777CAK3MME3 Features
416-BGA package Mounting type of Surface Mount
SPC5777CAK3MME3 Applications
There are a lot of NXP USA Inc. SPC5777CAK3MME3 Microcontroller applications.