8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 416-BGA
SOT-23
SPC5777CAK3MME3R Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
416-BGA
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Series
MPC57xx
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Speed
264MHz
RAM Size
512K x 8
Voltage - Supply (Vcc/Vdd)
3V~5.5V
Core Processor
e200z7
Peripherals
DMA, LVD, POR, Zipwire
Program Memory Type
FLASH
Core Size
32-Bit Tri-Core
Program Memory Size
8MB 8M x 8
Connectivity
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Data Converter
A/D 16b Sigma-Delta, eQADC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
500
$34.35390
$17176.95
SPC5777CAK3MME3R Product Details
SPC5777CAK3MME3R Overview
A 416-BGA package is included. This Microcontroller is mounted using the Surface Mount mounting type. Powered by the 32-Bit Tri-Core core, it offers a wide range of capabilities. The type of memory that the program uses is FLASH. The temperature range of this Microcontroller is within the range of -40°C~125°C TA. MPC57xx series components belong to this electrical component. Its program memory size is 8MB 8M x 8. There is a e200z7 Core Processor inside MCU that provides this device with its power.
SPC5777CAK3MME3R Features
416-BGA package Mounting type of Surface Mount
SPC5777CAK3MME3R Applications
There are a lot of NXP USA Inc. SPC5777CAK3MME3R Microcontroller applications.