8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 516-BGA
SOT-23
SPC5777CAK3MMO3R Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mounting Type
Surface Mount
Package / Case
516-BGA
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Series
MPC57xx
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Oscillator Type
Internal
Speed
264MHz
RAM Size
512K x 8
Voltage - Supply (Vcc/Vdd)
3V~5.5V
Core Processor
e200z7
Peripherals
DMA, LVD, POR, Zipwire
Program Memory Type
FLASH
Core Size
32-Bit Tri-Core
Program Memory Size
8MB 8M x 8
Connectivity
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Data Converter
A/D 16b Sigma-Delta, eQADC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
500
$36.04300
$18021.5
SPC5777CAK3MMO3R Product Details
SPC5777CAK3MMO3R Overview
The package has a 516-BGA shape. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit Tri-Core core. As far as its program memory type is concerned, it is FLASH. Temperatures within -40°C~125°C TA range are measured by this Microcontroller. The MPC57xx series is comprised of this electrical component. The electronic part has a program memory size of 8MB 8M x 8. There's a e200z7 Core Processor inside.
SPC5777CAK3MMO3R Features
516-BGA package Mounting type of Surface Mount
SPC5777CAK3MMO3R Applications
There are a lot of NXP USA Inc. SPC5777CAK3MMO3R Microcontroller applications.