SPC5777CCK3MME3

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Manufacturer part number:SPC5777CCK3MME3

Manufacturer:NXP USA Inc.

Description:8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 416-BGA

Case Package:SOT-23

Datasheet:SPC5777CCK3MME3 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	16 Weeks
Mounting Type	Surface Mount
Package / Case	416-BGA
Surface Mount	YES
Operating Temperature	-40°C~125°C TA
Packaging	Tray
Series	MPC57xx
Published	2012
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	416
ECCN Code	5A992
Additional Feature	ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	S-PBGA-B416
Supply Voltage-Max (Vsup)	1.32V
Supply Voltage-Min (Vsup)	1.2V
Oscillator Type	Internal
Speed	264MHz
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	3V~5.5V
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC
Core Processor	e200z7
Peripherals	DMA, LVD, POR, Zipwire
Clock Frequency	40MHz
Program Memory Type	FLASH
Core Size	32-Bit Tri-Core
Program Memory Size	8MB 8M x 8
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Bit Size	32
Data Converter	A/D 16b Sigma-Delta, eQADC
Has ADC	YES
DMA Channels	YES
PWM Channels	YES
DAC Channels	NO
ROM (words)	8388608
On Chip Program ROM Width	8
RAM (bytes)	524288
Length	27mm
Height Seated (Max)	2.02mm
Width	27mm
RoHS Status	ROHS3 Compliant

The SPC5777CCK3MME3 MCU is from the MPC5777C series based on three dual issues, 32-bit CPU core complexes (e200z7), two of which run in lockstep.

16 hardware semaphores
3-channel CRC module
8 MB on-chip flash memory
512 KB on-chip general-purpose SRAM including 64 KB standby RAM
Two multichannel direct memory access controllers (eDMA)
Dual-core Interrupt Controller (INTC)
Dual phase-locked loops (PLLs) with stable clock domain for peripherals and frequency modulation (FM) domain for computational shell
Crossbar Switch architecture for concurrent access to peripherals, flash memory, or RAM from multiple bus masters with End-To-End ECC
External Bus Interface (EBI) for calibration and application use
System Integration Unit (SIU)
Error Injection Module (EIM) and Error Reporting Module (ERM)
Four protected port output (PPO) pins
Boot Assist Module (BAM) supports serial bootload via CAN or SCI
Three second-generation Enhanced Time Processor Units (eTPUs)