SPC5777CDK3MMO3

new-10%

Manufacturer part number:SPC5777CDK3MMO3

Manufacturer:NXP USA Inc.

Description:8MB 8M x 8 FLASH e200z7 32-Bit Tri-Core Microcontroller MPC57xx Series 516-BGA

Case Package:SOT-23

Datasheet:SPC5777CDK3MMO3 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	16 Weeks
Mounting Type	Surface Mount
Package / Case	516-BGA
Surface Mount	YES
Operating Temperature	-40°C~125°C TA
Packaging	Tray
Series	MPC57xx
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	516
Additional Feature	ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	40
JESD-30 Code	S-PBGA-B516
Supply Voltage-Max (Vsup)	1.32V
Supply Voltage-Min (Vsup)	1.2V
Oscillator Type	Internal
Speed	264MHz
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	3V~5.5V
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC
Core Processor	e200z7
Peripherals	DMA, LVD, POR, Zipwire
Clock Frequency	40MHz
Program Memory Type	FLASH
Core Size	32-Bit Tri-Core
Program Memory Size	8MB 8M x 8
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Bit Size	32
Data Converter	A/D 16b Sigma-Delta, eQADC
Has ADC	YES
DMA Channels	YES
PWM Channels	YES
DAC Channels	NO
ROM (words)	8388608
On Chip Program ROM Width	8
RAM (bytes)	524288
Length	27mm
Height Seated (Max)	2.02mm
Width	27mm
RoHS Status	ROHS3 Compliant