28 Bit 1:2 Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTU32865 0.65mm 1.7V~1.9V 160-TFBGA
SOT-23
SSTU32865ET,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2004
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
240
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
20
Base Part Number
74SSTU32865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
2.15 ns
fmax-Min
270 MHz
Length
13mm
Height Seated (Max)
1.2mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTU32865ET,557 Product Details
SSTU32865ET,557 Overview
In packaging, Tray is used.In the 160-TFBGA package, it can be found.It is essential that the device be able to operate normally by supplying a voltage of 1.7V~1.9V.Electronic parts mounted using the Surface Mount method.This device operates at a temperature of 0°C~70°C.Approximately 28 bits of information can be stored in the memory.Parts related to the base part number 74SSTU32865 can be found.It adds up to 160 when all component pins are added together.Using 160 terminations prevents signals from reflecting off the transmission line.Other Logic ICs is a subcategory of it.For convenient use, the power supplies of 1.8V should be maintained.
SSTU32865ET,557 Features
SSTU32865ET,557 Applications
There are a lot of NXP USA Inc. SSTU32865ET,557 Specialty Logic ICs applications.