28 Bit 1:2 Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTU32865 0.65mm 1.7V~1.9V 160-TFBGA
SOT-23
SSTU32865ET/G,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
74SSTU32865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
2.15 ns
fmax-Min
270 MHz
Length
13mm
Height Seated (Max)
1.2mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTU32865ET/G,557 Product Details
SSTU32865ET/G,557 Overview
A packaging method that uses Tray is employed.It is included in package 160-TFBGA.1.7V~1.9V is provided to ensure that the device works normally.It is a type of electronic part mounted in the manner of Surface Mount.It operates at a temperature of 0°C~70°C.Using the memory, information is stored in 28 bits.In addition to its base part number 74SSTU32865, other related parts are available.Adding up all component pins equals 160.160 terminations are designed to prevent signals from reflecting off the end of the transmission line.The subcategory of Other Logic ICs can be used to include it.It is necessary to maintain the power supplies of 1.8V so that they can be used conveniently.
SSTU32865ET/G,557 Features
SSTU32865ET/G,557 Applications
There are a lot of NXP USA Inc. SSTU32865ET/G,557 Specialty Logic ICs applications.