28 Bit 1:2 Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTUA32S865 0.65mm 1.7V~2V 160-TFBGA
SOT-23
SSTUA32S865ET,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2007
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage
1.7V~2V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
74SSTUA32S865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Length
13mm
Height Seated (Max)
1.2mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTUA32S865ET,557 Product Details
SSTUA32S865ET,557 Overview
As a packaging method, Tray is used.The 160-TFBGA package contains it.To ensure normal operation of the device, 1.7V~2V is supplied.A Surface Mount mounting method is used for mounting electronic parts.The operating temperature is set to 0°C~70°C.Information is stored in the memory with a size of 28 bits.Based on its base part number 74SSTUA32S865, related parts can be found.All component pins add up to 160.The 160 terminations prevent signals from reflecting off the end of the transmission line.The subcategory Other Logic ICs can include it.Maintaining the power supply of 1.8V is necessary for convenient operation.
SSTUA32S865ET,557 Features
SSTUA32S865ET,557 Applications
There are a lot of NXP USA Inc. SSTUA32S865ET,557 Specialty Logic ICs applications.