28 Bit 1:2 Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA
SOT-23
SSTUH32865ET,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2005
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
Terminal Finish
Tin/Lead (Sn/Pb)
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
240
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
20
Base Part Number
74SSTUH32865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
COMPLEMENTARY
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Length
13mm
Height Seated (Max)
1.2mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTUH32865ET,557 Product Details
SSTUH32865ET,557 Overview
A packaging method based on Tray is employed.You can find it in package 160-TFBGA.The voltage of 1.7V~1.9V ensures that the device can operate normally.This electronic part is mounted by using the Surface Mount method.It is set to operate at 0°C~70°C.Using a size of 28 bits, the memory stores data.By using its base part number 74SSTUH32865, a number of related parts can be identified.In total, there are 160 pins on the component.With 160 terminations, signals won't reflect off the end of the transmission line.It belongs to the Other Logic ICs subcategory.It is important to maintain the power supplies of 1.8V for ease of use.
SSTUH32865ET,557 Features
SSTUH32865ET,557 Applications
There are a lot of NXP USA Inc. SSTUH32865ET,557 Specialty Logic ICs applications.