28 Bit 1:2 Registered Buffer with Parity 1.8V 0°C~70°C Specialty Logic IC 74SSTUH32865 0.65mm 1.7V~1.9V 160-TFBGA
SOT-23
SSTUH32865ET/G,557 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
160-TFBGA
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2005
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
160
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
1.7V~1.9V
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
74SSTUH32865
Pin Count
160
JESD-30 Code
R-PBGA-B160
Qualification Status
Not Qualified
Power Supplies
1.8V
Number of Bits
28
Output Characteristics
OPEN-DRAIN
Logic Type
1:2 Registered Buffer with Parity
Output Polarity
COMPLEMENTARY
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
1.8 ns
fmax-Min
450 MHz
Length
13mm
Height Seated (Max)
1.2mm
Width
9mm
RoHS Status
ROHS3 Compliant
SSTUH32865ET/G,557 Product Details
SSTUH32865ET/G,557 Overview
Packaging is done using Tray.The package 160-TFBGA includes it.For the device to function normally, voltage 1.7V~1.9V is supplied.The Surface Mount way is used to mount electronic parts.Temperature 0°C~70°C is set as operating temperature.To store information, the memory has a size of 28 bits.On the basis of its base part number 74SSTUH32865, you can find a number of related parts.A total of 160 pins are present on the component.Through 160 terminations, signals are prevented from reflecting off the end of transmission lines.As a subcategory of Other Logic ICs, it can be included.It is recommended that the power supplies for 1.8V be maintained for convenience.
SSTUH32865ET/G,557 Features
SSTUH32865ET/G,557 Applications
There are a lot of NXP USA Inc. SSTUH32865ET/G,557 Specialty Logic ICs applications.