13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 2.5V 0°C~70°C Specialty Logic IC 74SSTVN16859 0.5mm 2.3V~2.7V 56-VFQFN Exposed Pad
SOT-23
SSTVN16859BS,157 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
56-VFQFN Exposed Pad
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2004
JESD-609 Code
e4
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
56
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
HTS Code
8542.39.00.01
Subcategory
Other Logic ICs
Technology
CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.3V~2.7V
Terminal Pitch
0.5mm
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
74SSTVN16859
Pin Count
56
JESD-30 Code
S-PQCC-N56
Qualification Status
Not Qualified
Power Supplies
2.5V
Number of Bits
13, 26
Logic Type
Registered Buffer with SSTL_2 Compatible I/O for DDR
Output Polarity
TRUE
Trigger Type
POSITIVE EDGE
Propagation Delay (tpd)
2.5 ns
fmax-Min
220 MHz
Length
8mm
Height Seated (Max)
1mm
Width
8mm
RoHS Status
ROHS3 Compliant
SSTVN16859BS,157 Product Details
SSTVN16859BS,157 Overview
A packaging method based on Tray is employed.You can find it in package 56-VFQFN Exposed Pad.The voltage of 2.3V~2.7V ensures that the device can operate normally.This electronic part is mounted by using the Surface Mount method.It is set to operate at 0°C~70°C.Using a size of 13, 26 bits, the memory stores data.By using its base part number 74SSTVN16859, a number of related parts can be identified.In total, there are 56 pins on the component.With 56 terminations, signals won't reflect off the end of the transmission line.It belongs to the Other Logic ICs subcategory.It is important to maintain the power supplies of 2.5V for ease of use.
SSTVN16859BS,157 Features
SSTVN16859BS,157 Applications
There are a lot of NXP USA Inc. SSTVN16859BS,157 Specialty Logic ICs applications.